Jubelkiks til Bosch
Bosch Packaging Technology modtager WorldStar 2016 pris for sit to-i-en kiksemballage-system, der overbeviste juryen med unik fleksibilitet (på engelsk)
Essential to the assessment is for a product to combine innovation with outstanding execution.
The jurors evaluated a total of 293 projects from 35 countries across ten categories. The official award ceremony will take place in May 2016 during the International Packaging Conference in Budapest, Hungary.
Highly flexible biscuit packaging system
The biscuit packaging solution from Bosch is the first of its kind which allows for fast changeovers between slug and pile packs on the same line.
This ensures optimal product flow and combines high output with careful handling of all kinds and shapes of biscuits. It also enables manufacturers to change pack sizes in a minimum of time.
No machine parts are required to be changed for the purposes of switching between pack formats. This kind of capability allows food manufacturers to introduce different formats and special sales campaigns at very short notice, addressing fast changing consumer demands.
As part of the Bosch portfolio, the entire system – from product distribution right through to primary and secondary packaging – has been designed as a seamlessly integrated system for maximum overall equipment effectiveness (OEE).
The Two-in-One biscuit packaging system also takes up less floor space than the two separate machines previously required to produce both pack styles. Since its launch in 2014, several systems have already been sold to well-known biscuit manufacturers across the globe.
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World Packaging Organization
The World Packaging Organization (WPO) is a non-profit, non-governmental, international federation of national and regional packaging institutes and associations as well as other member such as individual companies. The federation was founded in 1968, inspired by the vision of a ‘better quality of life through better packaging for more people'. One of its goals include promoting the development of packaging technology.
